Title: 4.1 Surface Mount Soldering Quiz
Course: Electronics Assembly & Soldering (Sandbox) > Section: Module 4: Surface Mount Soldering

Q: The most obvious difference between through-hole and SMT technologies is:
- the components are much smaller in SMT.
- as the name implies, soldering is done on the same side of the board as component placement in SMT.
- you should always use lead-tin solder when soldering SMT.
- Both a and b
A: Both a and b

Q: The best tool to use with SMT is _____.
- wire strippers
- needle nose pliers
- tweezers
- side cutters
A: tweezers

Q: The first step is always...
- applying flux to the lands or pads.
- scraping the oxidation off the lands or pads.
- centering the component on the lands or pads.
A: applying flux to the lands or pads.

Q: The second step is to...
- clean your board.
- make sure that your tweezers are the right size to pick up your components.
- apply a small amount of solder to one of the lands or pads.
A: apply a small amount of solder to one of the lands or pads.

Q: When using the tweezers, you should...
- use the tweezers as scissors to open your bag or components.
- get rid of that pesky sliver.
- position the component between the lands.
- Both a and c
A: position the component between the lands.

Q: Holding the component on the land with the tweezers, re-wet the solder. As soon as it has cooled, __________.
- add more flux
- solder the remaining land
- go on to the next component
A: solder the remaining land

Q: When you solder SMT components with legs, flux the lands or pads and tack down the corner legs on the corresponding lands, making sure they are aligned properly. Then, __________.
- carefully solder leach leg individually by carefully stroking or painting each leg with solder.
- use Colin's method: bridge all the legs and then desolder with solder wick or a solder pump.
- hire someone to do the actual soldering.
- Actually a or b are legit
A: carefully solder leach leg individually by carefully stroking or painting each leg with solder.