E SC 212: Basic Nanotechnology Processes

Collection description:
This collection, from the Nanotechnology Applications and Career Knowledge Support (NACK) Center at Pennsylvania State University), includes materials from the undergraduate laboratory course titled Basic Nanotechnology Processes. The following seven units are included in the course:

1. An Introduction to Processing.
2. An Introduction to Uses of Plasma in Processing
3. An Introduction to Wet Etching
4. An Introduction to Basic Pattern Transfer
5. Chemical Vapor Deposition
6. Physical Deposition
7. Advanced Etch Systems

Course Contents:
Each unit includes a number of lectures and and associated laboratory activities that can be viewed separately or downloaded in .ppt and .pdf formats. Lectures provide in-depth coverage of each topic, including illustrations, examples, and comprehensive information. Each lab includes a variety of information, such as an objective, background information, a detailed procedure, charts and tables, and follow-up questions. Course lectures are available to view separately.

The following labs are included:

• Introduction to LPCVD and PECVD
• Introduction to Physical Vapor Deposition (PVD): Thermal Evaporation of a Microarray
• Physical Vapor Deposition (PVD): Evaporator Practice
• Introduction to Top-down Lithography Contact and Proximity Lithography
• Liftoff and Surface Modification Lab
• Introduction to Plasma-based Processing
• Dry Etch Rate Lab for Photoresist, SiO2 and Si3N4
• Introduction to Contact Lithography
• Introduction to Low Pressure Chemical Vapor Deposition
• Liftoff Lab
• PVD Uniformity Analysis
• Reactive Ion Etch Lab

For orientation purposes 212 Unit 1 Lecture 1 is included as a separate attachment and offers a sample of the type of material included in this course.

Below is a list of the files included in the .zip attachment. The size of each file is included in parenthesis.

E SC 212 - Basic Nanotechnology Processes.zip (44 files, 81.8 MB)

• Unit 1 - An Introduction to Processing (4, files 6.18 MB)
• Unit 2 - An Introduction to Uses of Plasma in Processing (16 files, 22.4 MB)
• Unit 3 - An Introduction to Wet Etching (4 files, 4.84 MB)
• Unit 4 - An Introduction to Basic Pattern Transfer (4 files, 8.36 MB)
• Unit 5 - Chemical Vapor Deposition (7 files, 29.5 MB)
• Unit 6 - Physical Deposition (4 files, 4.72 MB)
• Unit 7 - Advanced Etch Systems (4 files, 5.64 MB)

E SC 212 - Basic Nanotechnology Processes Laboratory.zip (12 files, 10.1 MB)

• Introduction to LPCVD and PECVD (212_Lab_12 Introduction_to_LPCVD_and_PECVD 06 24 10.doc 1.47 MB)
• Introduction to Physical Vapor Deposition (PVD): Thermal Evaporation of a Microarray (212_Lab_3 Intro PVD Thermal Evaporation of a Microarray 06 24 10.doc 510 KB)
• Physical Vapor Deposition (PVD): Evaporator Practice (212_Lab_4 PVD Evap Practice 06 24 10.doc 2.17 MB)
• Introduction to Top-down Lithography Contact and Proximity Lithography (212_Lab_6 Intro to Litho 06 24 10.doc 150 KB)
• Liftoff and Surface Modification Lab (212_Lab_8 Liftoff 06 24 10.doc 60.5 KB)
• Introduction to Plasma-based Processing (212_Lab_10 Introduction to Plasma Processing 06 24 10.doc 3.50 MB)
• Dry Etch Rate Lab for Photoresist, SiO2 and Si3N4 (212_Lab_11 Reactive Ion Etch Rate Lab 06 24 10.doc 1.29 KB)
• Introduction to Contact Lithography (Intro_to_Litho_Online_Lab.pdf 174 KB)
• Introduction to Low Pressure Chemical Vapor Deposition (Introduction_to_LPCVD_online_lab-FINAL.pdf 264 KB)
• Liftoff Lab (Liftoff_Online_Lab-FINAL.pdf 876 KB)
• PVD Uniformity Analysis (PVD_Uniformity_Analysis_Lab.pdf 534 KB)
• Reactive Ion Etch Lab (RIE_Online_Lab.pdf 403 KB)