Dry Etch Rate Lab for Photoresist, SiO2 and Si3N4

This lab, from Pennsylvania State University, provides insight into the dry etch process. During the lab, students will gain experience with the Technics Micro-80 and the Plasma Therm 720 Reactive Ion Etch systems. The goal of the lesson is to determine "etch rates for photoresist, silicon nitride, and silicon dioxide based on varying the processes conditions to build an understanding of how these changes affect etch rates." The lab is split over two days and covers the Ellipsometer and the Profilometer systems.